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TS1TMTE710T-I
1TB. M.2 2280. PCIe Gen4x4. 4CH. M-Key. 3D TLC BiCS5. PE: 3K. wide temp.
< ATPAKAĻSSD / DRAM MODUĻI / ATMIŅAS KARTES / HDD  >  PCIe M.2 SSDs
1TB. M.2 2280. PCIe Gen4x4. 4CH. M-Key. 3D TLC BiCS5. PE: 3K. wide temp.
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€ 197.339 / gab
€ 163.09 / gab
AR PVN BEZ PVN
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Artikuls:TS1TMTE710T-ICopy
Ražotājs:TRANSCEND
Web:www.transcend-info.c...
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Apraksts

Transcends M.2 SSD MTE710T features the PCI Express (PCIe) Gen 4 x4 interface and is compatible with NVM Express (NVMe) 1.4 specifications to achieve never-before-seen transfer speeds. The MTE710T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ- gold finger PCB and Corner Bond technology, the MTE710T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature range (-20℃~75℃).

Transcend also offers the MTE710T-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality and optimal reliability.

Specification:

Product Description: Transcend MTE710T-I - SSD - 1 TB - PCIe 4.0 x4 (NVMe)

Form Factor: M.2 2280 (double-sided)

Features: TRIM support, Advanced Garbage Collection, thermal sensor, Advanced Global Wear Leveling, Bad Block Management, Power Shield, SLC cache, Wide Temperature, NVM Express (NVMe) 1.4, DDR4 DRAM Cache, 3K P/E cycles (Programme/Erase cycles), Dynamic thermal throttling, Corner Bond technology, PCB gold finger, Read Disturbance, Early Move technology, 112-layer 3D NAND technology, S.M.A.R.T.

Dimensions: (WxDxH) 22 mm x 80 mm x 3.58 mm

Type: Solid state drive - internal

Interface PCIe 4.0 x4 (NVMe)

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Baltic Project Group SIA
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